模拟版图设计工程师
面议西安市本科1-3年
职位描述
Responsibilities:
1. Physical Design for Memory Products: Full custom Layout for analog and digital circuits in High performance DRAMs.
2. Floor planning signal- and bus planning according to predefined specifications.
3. Chip size optimization.
4. Area- and parasitic optimized layout.
5. Assembly of BLKs and top level hierarchies including routing.
6. Verification of circuits (Design Rule Check, Layout versus Schematic, Electrical rule check).
7. Generation of fill structures according to technology requirements.
8. Optical simulations on technology driven circuits.
9. Investigations on Electro migration and IR drop.Requirements:
1. Bachelor in Microelectronics, Electronic Engineering, or related field.
2. Familiar with CAD software.
3. Familiar with semiconductor process and structures of devices.
4. Team oriented, love to work in young, international and highly motivated teams.
5. Good communication skills.
6. High grade of flexibility.
7. Highly motivated and engaged.
8. Experience in digital analog and/or mixture signal IC is preferred.
9. Experience in Flash、SRAM and DRAM design is preferred.
10. Experience in backend design flow (APR) is preferred.
11. English language skill in writing and speaking is a must.
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