平头哥-封装工艺工程师-深圳
深圳市硕士应届
岗位职责
1. 参与封装方案设计，负责芯片封装方案的DFM落地与竞争力
Participate in the Chip packaging solution design，and responsible for the DFM implementation and competitiveness of chip packaging solutions
2. 负责芯片封装相关NPI阶段生产制造及工程工艺质量保障，工艺失效分析及改进措施制定与落地，完成试产到量产的转移
Responsible for chip packaging related NPI manufacturing and engineering process quality assurance, process failure analysis, process improvement and implementation, and complete the transfer from NPI to SVM and HVM production
3. 负责芯片新材料、新封装技术应用的开发
Responsible for the development of new chip materials and new packaging technology applications
4. 负责定期组织供应商交流，梳理供应商能力，为封装方案设计提供能力支撑
Responsible for regularly organizing supplier exchanges (e.g. QTR), sorting out supplier capabilities, and providing capability support for packaging solution design
5. 通过技术维度支持供应链及采购体系维护有竞争力的供应商合作关系
Support the supply chain and procurement system through the technical dimension to maintain a competitive supplier partnership
任职要求
1. 电子，材料等相关专业，硕士或以上学历
Major in electronics, materials, etc., master's degree or above
2. 5年以上封装的相关工作经验；
More than 5 years of relevant work experience in packaging;
3. 有封装厂、Foundry供应商、材料商工作经验者优先；
Experience in packaging factory, foundry supplier and material supplier is preferred;
4. 熟悉不同封装类型的制程流程及关键工艺站点，有产品可靠性相关经验者优先
Familiar with the process flow and key process sites of different packaging types, and experience in product reliability is preferred
5. 熟悉统计学分析方法，对封装制程工艺分析工具有经验者优先
Familiar with statistical analysis methods, experience in packaging process analysis tools is preferred
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