数字后端工程师（3年可以试试）

1.0 微米至 5 纳米工艺节点。

提供设计支持，包括内部库与知识产权（library&IP）、工艺设计套件与技术文件（PDK&tech files）、设计流程等相关支持，确保客户顺利完成芯片流片与量产。

为客户提供从项目启动到流片阶段的培训与咨询服务，内容包括但不限于：知识产权组合（IP portfolio）、跨技术节点的性能 - 功耗 - 面积（PPA）优势、设计流程、物理设计指南及时序 / 功耗签核（sign-off）方法等。

凭借技术判断识别业务机会。

任职要求

电子工程（EE）、微电子或集成电路设计（IC design）相关专业。

至少 6 年工作经验，且具备成功的芯片流片（tapeout）经验；若有芯片实现设计经验，且熟悉物理设计与时序分析，将予以优先考虑。

具备良好的沟通能力与扎实的技术功底，学习意愿强，对客户有耐心。

岗位职责:

The position entails supporting TSMC's customers in China in the areas of design enablement and design related activities resulting in successful Tapeouts and Product ramp.

1.Technical support to promote tsmc technology platform to customers, from

1.0um to 5nm

2.Design support including in-house library&IP, PDK&tech files, design flow, ensure customer successful tapeout and production

3.Customer training & consultation from project kickoff to tapeout, includes but is not limited to: IP portfolio, PPA benefit cross technologies, design flow, physical design guidelines and timing/power sign-off methodologies, etc.

4.Identify business opportunity with technical judgement

任职要求:

1.Major in EE or micro-electronic,IC design

2.At least 6 years of working experience in sucessfully tapeout experience，chip implementation design wity physical and timing experience is preferred.

3.Good communication skill, solid technical background, willing to learn and patience to customers