晶圆切割工艺主任工程师

2, Have wafer Back ground & Back metal technical acknowledge; wafer mount process and UV technical experience. 晶圆减薄和背部镀晶技术知识；晶圆贴胶纸工艺和UV技术经验。

3, Well know about MOSFET overall assembly stations, specially, wafer Saw (Dicing) to Die Bond process steps 熟悉MOSFET全封装流程，特别的，熟悉晶圆切割到晶粒粘贴工艺各步骤。

4, Has wafer saw equipment; wafer mount equipment; UV machine procurement and specification experience or skill. 晶圆切割设备、晶圆贴胶纸设备、UV设备的采购和规格书撰写经验或能力。

5, For totally new wafer saw equipment; wafer mount equipment; UV machine setup; buyoff and release to mass production experience or skill. 晶圆切割设备、晶圆贴胶纸设备、UV设备的设置、验收和释放量产的经验或能力。

6, Good acknowledge about: saw blade structure; dicing setup; dicing mechanism stress; wafer mount tape and UV working. 关于：切割刀具结构；切割设置；切割物理应力；晶圆贴胶纸及UV解胶工作方式的知识储备。

7, Good engineering analysis and logical mindset to solve the trouble shooting. 良好的工程分析和逻辑思维以便于解决产线问题解决。

8，Strongly logical and engineering capabilities for wafer incoming and wafer saw failure analysis. 有较强的逻辑和工程分析能力应对晶圆来料坏品和晶圆切割的失效分析。

9, Able to define Process and system document as WI/SOP/OCAP/PFMEA/DFMEA定义工艺及系统文件如操作指引、流程标准、OCAP、工艺&设计失效模式与影响分析等。

10, DOE and parameter optimization project experience. DOE和参数优化项目经验。

11, Machine key parts safety storage definition; lifetime validation; qualification and cost reduction. 设备关键部件安全库存的建立；寿命评估；验收和成本节约。

12, To editable 8D report and short-term, mid-term and long-term action definition具备8D报告的撰写能力及短期、中期、长期改善行动定义。

Process Engineer (PE) capabilities 工程师能力要求：

1, More than 10yrs work experience in IC/MOS wafer saw (Dicing) Process. 超过10年的IC/MOS晶圆切割工艺工作经验。

2, Laser saw experience is an extra point激光切割经验是加分项。

3, Education: Bachelor or above 本科或以上

4, Major: Electric or Mechanism or Material related 电子或机械或材料相关专业

5, English can be used as working language (speaking and written) 英语能作为工作语言(说和写)