Sr. Wafer Service Engineering Manager

1. New wafer service process & equipment development, which includes but not limited to: wafer BGBM, wafer plating, wafer bumping, wafer ball drop, wafer molding, implant & etc.

2. Wafer service process control and continuous improvement.

3. Drive the yield improvement and cost reduction activities.

4. Qualify second source equipment / tooling / raw materials to ensure supplier change and competitive cost.

5. Drive the improvement of UPH and process efficiency.

6. Wafer level package process development and control.

7. Supporting package R&D activities.

8. Equipment and tooling management to ensure the daily output with acceptable quality.

9. Co-work with QRA team for trouble shooting and quality issue.

10. Ensure inline lots with quality excursion are properly handled and disposed of.

任职要求：

1. Bachelor above degree of science/engineering

2. More than 10 years’ experience in semiconductor industry, preferably to have wafer service engineering related working experience (BGBM, bumping process).

3. Analytical, problem solving and troubleshooting skills.

4. Wafer Backside Process & bumping process Knowledge

5. Fab process knowledge

6. Communication Skill

7. Project Management