Senior dry etch process engineer (职位编号：42139544)

manufacturing memory fab in Intel China working on edge 3D NAND product. Intel

and SK Hynix have an agreement for SK Hynix to acquire Intel's NAND memory and

storage business. and Intel will continue to manufacture NAND wafers at the

Dalian memory manufacturing until the final closing expected to occur in March

2025. Intel DMTM will continue to build on the success of our NAND technology

at a greater scale, play a larger role in supporting our customers. This job

requisition is to seek for strong candidates for the positions of Dry Etch

Senior Process Engineer, In this position you will work in a dynamic and

collaborative environment solving complex and challenging technical problems on

sophisticated Dry Etch Processes and Equipment, You will be responsible for

leading technology development enabling manufacture of innovative 3D NAND

Memory products Designing executing and analyzing experiments necessary to meet

engineering specifications for their process Participate in development of

intellectual property Development of the equipment necessary to exploit the

understanding gained in development in collaboration with equipment suppliers

Work effectively with the equipment supplier to identify shortcomings propose

and evaluate hardware modification to mitigate issues Operate manufacturing

line in order to integrate the many individual steps necessary for the

manufacture of complex 3D NAND memory, develop future generations of 3D NAND

process technologies through innovation product enhancement as well as

developing and enabling equipment and process capabilities. This position is

associated with the sale of Intel's NAND memory and storage business to SK.

This transaction will enhance the resources and potential of the business'

storage, and you will be joining a world-class team that will transition to

lead the SSD business at SK group. We will keep you informed updates and steps

related to this transaction.

Qualifications:

Candidate must have demonstrated a track record of excellence in creative

problem solving equipment capability enabling or manufacturing process

optimization in a relevant engineering organization.

Technical Qualifications:MS or PhD in a science or engineering field and

minimum 5 years of experience in semiconductor or 3 years in TD environment are

required Candidates with different levels of technical experiences will be

considered at different grade levels. Broad and in-depth knowledge of plasma

dry etch chambers processes is required. Mastery of principles and working

knowledge of various Dry etch processes and LAM etch equipment. Ability to

design execute and analyze experiments to screen and optimize various Dry Etch

processes and equipment to meet technology performance yield and reliability

and manufacturing process stability cost of ownership capacity improvement

targets. Strong problem-solving skills. Be master on MBPS and FMEA methodology.

Strong project management skills, good influence and communication skills.

Hands on experiences in technology development and technology transfer are

highly desired. Must be willing to learn and work in a dynamic fast paced

environment. Other Qualifications: Motivated self-starter with strong ability

to work independently as well as in a team environment. Strong verbal and

written communication skills in English. Think and operate independently while

simultaneously focusing on many diverse priorities. Flexibility and maturity in

facing uncertainties and changing priorities responsibilities. Commit to

aggressive goals and win with a can-do attitude. Act with velocity and a strong

sense of urgency. Respect cultural diversity and sensitivity. Agility in

learning improving and innovating.