Senior dry etch process engineer (职位编号：49701644)

manufacturing memory fab in Intel China working on leading edge 3D NAND

product. Intel and SK Hynix have an agreement for SK Hynix to acquire Intel's

NAND memory and storage business. and Intel will continue to manufacture NAND

wafers at the Dalian memory manufacturing until the final closing expected to

occur in March

2025. Intel DMTM will continue to build on the success of our

NAND technology at a greater scale, play a larger role in supporting our

customers. This job requisition is to seek for strong candidates for the

positions of Dry Etch Senior Process Engineer, In this position you will work

in a dynamic and collaborative environment solving complex and challenging

technical problems on sophisticated Dry Etch Processes and Equipment, You will

be responsible for leading technology development enabling manufacture of

innovative 3D NAND Memory products Designing executing and analyzing

experiments necessary to meet engineering specifications for their process

Participate in development of intellectual property Development of the

equipment necessary to exploit the understanding gained in development in

collaboration with equipment suppliers Work effectively with the equipment

supplier to identify shortcomings propose and evaluate hardware modification to

mitigate issues Operate manufacturing line in order to integrate the many

individual steps necessary for the manufacture of complex 3D NAND memory,

develop future generations of 3D NAND process technologies through innovation

product enhancement as well as developing and enabling equipment and process

capabilities. This position is associated with the sale of Intel's NAND memory

and storage business to SK. This transaction will enhance the resources and

potential of the business' storage, and you will be joining a world-class team

that will transition to lead the SSD business at SK group. We will keep you

informed updates and steps related to this transaction.

Qualifications:

Candidate must have demonstrated a track record of excellence in creative

problem solving equipment capability enabling or manufacturing process

optimization in a relevant engineering organization.

Technical Qualifications:

MS or PhD in a science or engineering field and minimum 5 years of experience

in semiconductor or 3 years in TD environment are required.

Candidates with different levels of technical experiences will be considered

at different grade levels.

Broad and in-depth knowledge of plasma dry etch chambers processes is required.

Mastery of principles and working knowledge of various Dry etch processes and

LAM etch equipment.

Ability to design execute and analyze experiments to screen and optimize

various Dry Etch processes and equipment to meet technology performance yield

and reliability and manufacturing process stability cost of ownership capacity

improvement targets.

Strong problem-solving skills. Be master on MBPS and FMEA methodology.

Strong project management skills, good influence and communication skills.

Hands on experiences in technology development and technology transfer are

highly desired.

Must be willing to learn and work in a dynamic fast paced environment.