Packaging Engineer封装工程师

Identifies the interaction between chip, material, equipment, and package

Works closely with the various business units within the company to understand future product needs and suggest material solutions.

Drive quality improvement and better efficiency of OSATs operation.

Qualifications

This position requires a candidate with Bachelor/ Master degree in Mechanical / Materials Engineering or equivalent with several years of relevant work and packaging program management experience.

Hands-on experience in various material and process such as Packaging, IC bumping, IC substrate.

Experience working closely with wafer fabrication facilities, OSATs highly desirable.

Knowledge of various packaging is required such as wire bond, flip chip, wafer level packaging

Working knowledge of AutoCAD, Cadence APD, Synoptics laker, Design of Experiments, statistical techniques and failure analysis techniques required.

Ability to multi-task and meet tight deadlines as well as excellent communication and interpersonal skills required.