高级硬件工程师

1. 负责机器人主控板、通信总线、传感器、电源模块等硬件电路的设计，包括原理图、PCB Layout和Gerber输出；

2. 负责相关元器件选型、验证和方案评审；

3. 负责电路板的硬件调试，并配合软件完成电路板的联调；

4. 负责EMC/EMI电磁兼容的设计与测试；

5. 负责相关产品技术文档的输出归档；

6. 解决完善产品硬件电路设计及量产过程中的相关问题。

Job Description:

1. Responsible for designing hardware circuits of robot main control boards, communication buses, sensors, power modules, etc., including schematic diagrams, PCB Layout, and Gerber output.

2. Undertake selection, verification of relevant components and scheme review.

3. Conduct hardware debugging of circuit boards and cooperate with software teams for joint debugging.

4. Be responsible for EMC/EMI design and testing.

5. Output and archive relevant product technical documents.

6. Solve problems in product hardware circuit design and mass production.

任职要求：

1. 硕士及以上学历，电子、电力等相关专业；3年及以上的嵌入式电路设计经验；至少有一款4层及以上量产PCB的设计经验；

2. 精通数字电路和模拟电路，熟悉主流的ARM/DSP使用及其外设电路的设计，熟悉STM32使用优先；

3. 熟悉EtherCAT、以太网、CAN、485、422、SPI、USART等总线电路的设计；

4. 精通开关电源电路设计，能完成主控芯片以及其他直流降压电源模块的设计；

5. 熟悉EMI/EMC设计和测试流程，有实际项目经验。

6. 精通Altium/Cadence等主流硬件开发工具；

7. 熟悉制板和贴片流程，有较强的动手能力；

8. 熟悉MOS等功率器件，有大功率驱动电路设计经验的优先；

9. 熟悉CPU、PCIe等高速电路设计的优先；

10. 良好的团队合作意识，能够很好地与团队其他成员进行配合工作，解决工作中遇到的各类实际问题，具有工业产品、电子消费品设计等相关经验者优先。

Job Requirement:

1. Master's degree or above in Electronics, Electrical Engineering or related majors; with 3+ years of embedded circuit design experience, and experience in designing at least one 4-layer or above mass-produced PCB.

2. Proficient in digital and analog circuits; familiar with the use of mainstream ARM/DSP and design of their peripheral circuits, with preference for familiarity with STM32.

3. Familiar with the design of bus circuits such as EtherCAT, Ethernet, CAN, 485, 422, SPI, and USART.

4. Proficient in switching power supply circuit design, capable of designing main control chips and other DC step-down power modules.

5. Familiar with EMI/EMC design and testing processes, with practical project experience.

6. Proficient in mainstream hardware development tools such as Altium and Cadence.

7. Familiar with board fabrication and SMT processes, with strong hands-on ability.

8. Familiar with power devices such as MOS; experience in high-power drive circuit design is preferred.

9. Familiarity with high-speed circuit design (e.g., CPU, PCIe) is preferred.

10. Good team spirit, able to cooperate well with other team members to solve practical problems; experience in industrial products or consumer electronics design is preferred.