封装工艺研发工程师

1. New Package Technology and New Platform Module Development

o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP).

o Good understanding of MRS and generate PRS with SCD definition.

o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.

o Familiar with DFM, to secure robust manufacturability with quality requirements.

o Good understanding of power module package design rule, design rule update with new platform development.

o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, etc.).

o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).

o Drive problem solving methodology with risk assessment to find technical issue and provide systematic solution.

o Strong knowledge and in-depth understanding of device-package interaction.

o Effectively working with team for on time development.

2. Technical Project Management and Communication

o Responsible for defining and ensuring adherence based on technical requirement, quality requirement, project timing and cost.

o Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition.

o Supporting to track and remind team members for tasks, deliverables, milestones of projects, successfully work with PM to be developed on time.

o Participate in all project/gate review, alignment with team.

Qualifications

1. At least 7 + years working experience in SMT/ Die attach/ Ag sintering, WB/ DS is a plus.

o Experienced areas: Power module package (transfer molded, gel filled) development, DSC experience is plus.

o Experienced packages: Transfer molded power module (Intelligent Power Module, Case Module, DSC experience is plus).

2. Education: BS or MS degree.

3. Skills:

o Fluent with English communication

o familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (ppt presentation).

4. Personal characteristics: self-motivated, independent, open mind to communicate, willing to take risk and managing.

?

onsemi?(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets,?onsemi?is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, alternative energy, and factory automation. With a highly differentiated and innovative product portfolio,?onsemi?creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for?onsemi?to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and?onsemi?is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by

2040.