3D 封装工程师 l 3D Packaging Expert(J13467)

1.Responsible for the development of advanced packaging process chip placement process;

2. Absorb the experience of path finding and apply it to actual product development;

3. New 3DS product introduction and process qualification;

4. Localization package related material and machine;

5. Investigate outsourcing vendors with specific 3D packaging capabilities and carry out technical cooperation with qualified OSAT. Need to travel frequently.

任职资格:

1.Proficient in FCCSP FC Attach process

2.Familiar with FCCSP FCA equipment machine material selection

3.Familiar with substrate related manufacturing process

4.Familiar with FCCSP assembly full process flow

5.Experience in TCB process development is preferred