晶圆切割设备工程师 - 封装

2, Well know about MOSFET overall assembly stations, specially, wafer Saw (Dicing) to Die Bond process steps 熟悉MOSFET全封装流程，特别的，熟悉晶圆切割到晶粒粘贴工艺各步骤。

3, Has wafer saw machine procurement and specification experience or skill. 具备晶圆切割设备采购和规格书撰写经验或能力。

4, For totally new machine setup; buyoff and release to mass production experience or skill. 具备全新设备的设置、验收和释放量产的经验或能力。

5, Good engineering analysis and logical mindset to solve the trouble shooting. 良好的工程分析和逻辑思维以便于解决产线问题解决。

6，Strongly operation skills on machine’s calibration and regularly PM较强的设备校准和定期PM动手能力。

7, Clearly identify machine calibration; regularly PM; general operation SOP/WI and checking list. 能清晰定义设备校准、定期保养、基本操作的标准操作流程/指引及检查清单。

8, Basically know about machine key parts safety storage definition; lifetime validation; qualification and cost reduction. 基本掌握设备关键部件安全库存的建立；寿命评估；验收和成本节约。

9, To editable 8D report and EFMEA definition 具备8D报告的撰写能力及设备FMEA定义。

Equipment Engineer (EE) capabilities 工程师能力要求：

1, More than 5yrs work experience in IC/MOS wafer saw (Dicing) equipment. 超过5年的IC/MOS晶圆切割设备工作经验。

2, Wafer laser saw experience is an extra point激光切割经验是加分项。

3, Education: Junior college or above 大专或以上

4, Major: Electric or mechanism related 电子或机械相关专业