埃尔法新材料（深圳）有限公司

AlphaPro Technology is a leading enterprise specializing in encapsulation materials, covering critical functions such as structural bonding, module encapsulation, heat dissipation management, and conductive shielding. Our strong technical research capabilities allow us to excel in providing high-performance tapes and adhesives for premium sectors like medical, new energy, consumer electronics, and especially semiconductors.

Backed by in-depth collaborations with institutions including the University of Hong Kong, Hong Kong University of Science and Technology, Northwestern University, Technical University of Munich, and East China University of Science and Technology, we continuously break technological barriers. In semiconductor manufacturing, we understand its high precision and reliability requirements, developing alternatives to imported products. For instance, our wafer dicing tapes ensure precise cutting with minimal cracking risks; our grinding tapes achieve uniform grinding to enhance chip surface quality; and our chip-level underfill adhesives boast excellent flowability and curing properties, improving chip stability and reliability.

Currently, AlphaPro operates a center in Shenzhen, R&D facilities in Hong Kong and Shanghai, a manufacturing base in Dongguan, and operational offices and cooperative factories in Germany and Vietnam. This global layout enables us to provide flexible and convenient solutions to customers worldwide. Whether offering standard products or tailored services and solutions, AlphaPro Technology, with its exceptional technical expertise and extensive industry experience, is an ideal partner for mid-to-high-end clients in encapsulation materials.

In the semiconductor packaging materials market, 95% of the domestic share is dominated by foreign players. Against this backdrop, AlphaPro Technology stands out as a pioneer among local firms.

Our technology, enhanced through partnerships with HKU, distinguishes us. We have developed advanced formulations for our wafer dicing tapes, grinding tapes, and chip-level underfill adhesives. For example, our wafer dicing tapes feature proprietary coating technology that minimizes tape stretch during dicing, ensuring higher precision than competitors. This is vital since even minor deviations can cause costly defects in semiconductor manufacturing.

Our grinding tapes are engineered with a unique abrasive distribution system, enabling more efficient and uniform material removal. This accelerates the grinding process while improving semiconductor component surface finishes, a capability few local competitors match.

All our products are meticulously designed to integrate seamlessly into semiconductor manufacturing processes. Our chip-level underfill adhesives, for instance, have a low coefficient of thermal expansion, protecting delicate chips from thermal stress during packaging and enhancing device long-term reliability.

Our high-performance tapes and adhesives are fully capable of replacing imports. Rigorous testing shows they perform comparably or even better than leading foreign products, presenting a significant opportunity to capture the domestic market dominated by foreign suppliers.

We offer custom services to meet client-specific needs. With operations in Shenzhen, R&D in Hong Kong and Shanghai, and production in collaboration with a factory in Dongguan, we have a comprehensive and efficient business model. This allows us to swiftly respond to market demands and provide flexible solutions globally. Investing in AlphaPro Technology means supporting a company poised to disrupt the semiconductor packaging materials market and deliver substantial returns.