米艾德智能科技(苏州)有限公司招聘

modules, LiDAR, VR/AR, sensors, and optical imaging products. We offer the most effective system and assembly solutions for all levels of packaging, including multi-functional and highly adaptable system solutions for chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, TO, and hermetic packaging.

We own two brands: MID (equipment brand) and Sumtev (instrumentation brand).

Our main service industries are optical communications and semiconductor industries.

With 8 years of accumulation, we have a team with high technical standards in system design, software and hardware development, and project management. We are listed by customers as strategic cooperative suppliers.