上海天承科技股份有限公司
20-99人
公司优势
天承科技成立于2010年，是一家集自主研发、智能化管理、全球销售和系统售后服务的功能性湿电子化学品的专业供应商。产品广泛应用于电子电路、半导体先进封装、显示屏、新能源等领域。
2023年，公司在科创板上市，股票代码688603，发展进入历史性新征程。
天承科技一直专注于化学沉积、电镀和表面处理等先进技术领域，研发团队深耕相关行业技术三十余年，是国内外相关领域领先的领军企业之一。在电子电路领域，公司与国际竞争对手并驾齐驱，其产品与技术服务在行业中广受好评。尤其在聚酰亚胺、PET树脂、ABF材料表面的金属化技术方面，公司产品性能稳定，获得了主流封装载板厂和知名OEM的认可。
公司在半导体封装领域的再布线层、凸点和硅通孔电镀系列产品也得到了知名封装厂的肯定，性能达到国际先进水平。顺应高性能计算和人工智能的发展趋势，公司迅速投入玻璃通孔TGV金属化技术的研发，并已获得产业链的广泛认可。同时与知名OEM企业建立了深入合作关系，共同推动产业化进程。
天承科技将凭借强大的自主研发能力、持续的创新精神和全球化的战略布局，持续为客户提供高性能的功能性湿电子化学品以及优质的服务，是您值得信赖的合作伙伴！
Founded in 2010, Skychem has been dedicated to functional wet electronic chemicals for the electronic circuit, semiconductor packaging, display, and new energy industries.
Skychem went public on the SSE STAR Market in 2023 with stock code 688603, embarking on a historic new journey of development.
Skychem has always been dedicated to the cutting-edge fields of chemical deposition, electroplating, and surface treatment. With over three decades of experience, our R&D team has deep expertise in these industries, making us one of the most professional and leading companies in both domestic and international markets. In the realm of electronic circuits, the company is on par with international competitors, and its products and technical services have garnered widespread acclaim within the sector. Particularly in the metallization technology on surfaces of polyimide, PET, and ABF materials, the company's products are noted for their stable performance and have earned the recognition of mainstream IC substrate manufacturers and top-tier OEMs.
In the field of semiconductor packaging, including redistribution layers (RDL), bumpings, and through-silicon via (TSV) electroplating, Skychem has also received affirmation from renowned packaging factories. With the development of high-performance computing (HPC) and artificial intelligence (AI), the company has rapidly invested in through-glass via (TGV) metallization technology, which has been widely recognized by the industry players. At the same time, in-depth cooperative relationships have been established with top-tier OEMs, to contribute together to the scalling up of this technologies in various applications.
Skychem will continue to leverage its robust R&D capabilities, continuous innovation, and global strategic to provide customers with high-performance functional wet electronic chemicals and quality services. We are a reliable partner you can trust!
福利待遇：
1、周末双休；
2、五险一金（按国家规定为员工缴纳社会保险，住房公积金）；
3、享有国家规定的法定节假日；
4、完善的员工职业生涯规划，提供完善、公平、透明的晋升通道；
5、公司完善的福利薪酬机制，为员工提供优越的节日福利。
欢迎新老客户和朋友与天承携手合作，共赢互利，共创未来！
期待您的加入！
2023年，公司在科创板上市，股票代码688603，发展进入历史性新征程。
天承科技一直专注于化学沉积、电镀和表面处理等先进技术领域，研发团队深耕相关行业技术三十余年，是国内外相关领域领先的领军企业之一。在电子电路领域，公司与国际竞争对手并驾齐驱，其产品与技术服务在行业中广受好评。尤其在聚酰亚胺、PET树脂、ABF材料表面的金属化技术方面，公司产品性能稳定，获得了主流封装载板厂和知名OEM的认可。
公司在半导体封装领域的再布线层、凸点和硅通孔电镀系列产品也得到了知名封装厂的肯定，性能达到国际先进水平。顺应高性能计算和人工智能的发展趋势，公司迅速投入玻璃通孔TGV金属化技术的研发，并已获得产业链的广泛认可。同时与知名OEM企业建立了深入合作关系，共同推动产业化进程。
天承科技将凭借强大的自主研发能力、持续的创新精神和全球化的战略布局，持续为客户提供高性能的功能性湿电子化学品以及优质的服务，是您值得信赖的合作伙伴！
Founded in 2010, Skychem has been dedicated to functional wet electronic chemicals for the electronic circuit, semiconductor packaging, display, and new energy industries.
Skychem went public on the SSE STAR Market in 2023 with stock code 688603, embarking on a historic new journey of development.
Skychem has always been dedicated to the cutting-edge fields of chemical deposition, electroplating, and surface treatment. With over three decades of experience, our R&D team has deep expertise in these industries, making us one of the most professional and leading companies in both domestic and international markets. In the realm of electronic circuits, the company is on par with international competitors, and its products and technical services have garnered widespread acclaim within the sector. Particularly in the metallization technology on surfaces of polyimide, PET, and ABF materials, the company's products are noted for their stable performance and have earned the recognition of mainstream IC substrate manufacturers and top-tier OEMs.
In the field of semiconductor packaging, including redistribution layers (RDL), bumpings, and through-silicon via (TSV) electroplating, Skychem has also received affirmation from renowned packaging factories. With the development of high-performance computing (HPC) and artificial intelligence (AI), the company has rapidly invested in through-glass via (TGV) metallization technology, which has been widely recognized by the industry players. At the same time, in-depth cooperative relationships have been established with top-tier OEMs, to contribute together to the scalling up of this technologies in various applications.
Skychem will continue to leverage its robust R&D capabilities, continuous innovation, and global strategic to provide customers with high-performance functional wet electronic chemicals and quality services. We are a reliable partner you can trust!
福利待遇：
1、周末双休；
2、五险一金（按国家规定为员工缴纳社会保险，住房公积金）；
3、享有国家规定的法定节假日；
4、完善的员工职业生涯规划，提供完善、公平、透明的晋升通道；
5、公司完善的福利薪酬机制，为员工提供优越的节日福利。
欢迎新老客户和朋友与天承携手合作，共赢互利，共创未来！
期待您的加入！
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